Remove and replace or reflow ball-grid array components (BGA’s), as production line repair.
ESSENTIAL DUTIES AND RESPONSIBILITIES
· Support manufacturing in the removal, replacement, and reflow of BGA components.
· Visually analyze x-ray to determine circuit shorts or insufficient solder.
· Ensure quality (work meets or exceed Jabil workmanship Standards) and improve efficiency through the use of the CIQ system.
· Fill out daily logs and other paperwork as required.
· Ensure assemblies are properly handled and marked.
· All repairs will follow Jabil’s repair techniques.
· Ensure that assigned area is clean and organized.
· Adhere to all safety and health rules and regulations associated with this position and as directed by supervisor.
· Comply and follow all procedures within the company security policy.
· May perform other duties and responsibilities as assigned.
· Ability to read and comprehend simple instructions, short correspondence, and memos.
· Ability to write simple correspondence.
· Read and understand visual aid.
· Must be able to calculate quantity of parts to be prepped and ready for use at any time.
· Ability to add and subtract two digit numbers and to multiply and divide with 10's and 100's.
· Ability to apply common sense understanding to carry out simple one- or two-step instructions.
· Ability to deal with standardized situations with only occasional or no variables.
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