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Sr. Photonics packaging engineer

Req ID: J2315721-IL

  • Location
    Wuhan, Hubei, China
  • Category Engineering
  • Posted Tuesday, April 26, 2022
  • Type Full time
  • Job Type Permanent Employee

Job Description

Skills/Qualifications (Include Education, Skills & Experience):


1.     教育背景:
本科以上学历(材料、微电子、封装等相关专业)
2.    工作经验:
光芯片封装设计或工艺设计研发领域3年以上工作经验。
3.    技能要求:
1)    熟悉Die bonding, wire bonding, Flip-chip等封装工艺或熟悉平面耦合、同轴耦合或对接耦合等光学封装耦合技术,对封装材料特性和各类工艺问题有深入的理解和经验。
2)    熟练使用自动键合机,贴片机。
2)了解光器件封装常见失效模式及相应的测试方法、原因分析和解决方案。
3) 具备量产器件可靠性分析、寿命评估、失效分析解决经验。
4)对封装胶材,膜材的物理化学特性有深入理解包括不限于UV胶,树脂胶,双面胶等,能够根据芯片功能要求进行材料选型和制定封装工艺方案。
5)仔细、动手能力强,有较强的数据分析能力
6)有硅光芯片封装经验者优先。
7)熟悉晶圆级别键合封装技术者优先,有合成定制胶材经验者优先。

Responsibilities:
1.    基于光芯片以及最终封装要求,设计工艺流程(贴片或倒装、金丝焊接、光耦合等),制定相应的封装实验,并验证。
2.     解决量产过程中封装相关的可靠性与良率问题,处理与芯片相关的工艺失效问题。
3.    编写相关封装技术开发与方案设计文档。
4.    配合产品工程师完成新品转产、失效分析与改进及产品的降成本及生产效率提高的工作。
 

/51 /ZP /LP

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