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Sr. Project Manager

Req ID: J2322214-IL

  • Location
    Wuhan, Hubei, China
  • Category Design Services Group
  • Posted Wednesday, June 8, 2022
  • Type Full time
  • Job Type Permanent Employee

Job Description

Skills/Qualifications (Include Education, Skills & Experience):
1.     教育背景:
2.    工作经验:
3.    技能要求:
1)    熟悉Die bonding, wire bonding, Flip-chip等封装工艺或熟悉平面耦合、同轴耦合或对接耦合等光学封装耦合技术,对封装材料特性和各类工艺问题有深入的理解和经验。
2)    熟练使用自动键合机,贴片机。
3) 具备量产器件可靠性分析、寿命评估、失效分析解决经验。


1.    带领封装团队基于光芯片以及最终封装要求,设计工艺流程(贴片或倒装、金丝焊接、光耦合等),制定相应的封装实验,并验证。
2.     解决量产过程中封装相关的可靠性与良率问题,处理与芯片相关的工艺失效问题。
3.   具有良好的沟通表达能力,良好的团队合作精神,能够激励团队。
4.    配合制造部门完成新品转产、失效分析与改进及产品的降成本及生产效率提高的工作。

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