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Photonics Packaging Engineer

Req ID: J2291469

  • Ubicación
    Ottawa, Ontario, Canada
    Pleasanton, CA, California, United States of America
  • Categoría Grupo de Servicios de Diseño
  • Publicado martes, 26 de octubre de 2021
  • Tipo Tiempo completo
  • Tipo de Empleo Empleado Permanente

Descripción del Trabajo

JOB SUMMARY

A Principal Engineer leads and/or advises design teams focused on significant and unique design projects and challenges.  Delivers projects through the entire product development process into production.  As a Principal, you will be expected to demonstrate a level of expertise in a particular area that matches or exceeds the expertise of customers. Consults on system architectures, assess technical requirements and competencies needed during quoting and oversee design progressions during product developments.  Mentors and leads others in the organization to build team members design capability.

ESSENTIAL DUTIES AND RESPONSIBILITIES

  • Cultivate new opportunities for partnership and customers to further utilize Jabil Photonics wide ranging packaging capabilities.  Interact with potential customers and partners primarily in the North American and EMEA Region.
  • Represent Jabil Photonics for running projects in the North American and EMEA Regions.
  • Develop opportunities to use and showcase Jabil's advanced technology center in San Jose, USA.
  • Work closely with the Wuhan R&D team, taking on appropriate specification writing, process development, and design review tasks as needed.
  • Drive yield improvement, cost reduction and ongoing product sustaining for Jabil Photonics lines in Wuhan and Penang.
  • Design experiments to further improve solutions for cost and performance.
  • Ensure reliability requirements are met.
  • When permitted by health regulations, travel to various sites in North America, EMEA and also Wuhan as needed to represent Jabil Photonics but also to use key process equipment in San Jose and Wuhan.
  • Delivers solutions that require expertise across multiple competencies with limited supervision.
  • Leads and/or advises system architecture analysis and clarifies design requirements to define the appropriate architecture for the design team.
  • Evaluating/selecting mechanical components and materials (for example adhesives), and makes recommendations to component manufacturing, regarding roadmaps and feature enhancements.
  • Communicates technical aspects of a project effectively to customer, and can lead some customer engagements.
  • Lead design innovations and potential patentable solutions.
  • Lead resolution of complex design issues and manages design trade-offs.
  • Train/coach other engineers in design analysis and tools.
  • May perform other duties and responsibilities as assigned.

JOB QUALIFICATIONS

KNOWLEDGE REQUIREMENTS

TECHNICAL KNOWLEDGE & SKILLS

  • Coordinates with professional networks to answer unique issues related to Industry or specific sector requirements.
  • Broad knowledge developing high complexity projects that have required multiple Design specializations or competencies.
  • In-depth knowledge and use of key development tools and design standards.

NON-TECHNICAL KNOWLEDGE & SKILLS

  • Influence others and share best practices
  • Effectively communicate with good understanding of English.
  • Work as part of a global team
  • Assess a project and articulating risk while developing project milestones.
  • Develop projects in a stage-gate process (PLCQ)
  • Mentor less experienced engineers.
  • Leads projects with multiple engineers assigned.
  • Leads cross-functional and design reviews.

EDUCATION & EXPERIENCE REQUIREMENTS

  • Mechanical or Electrical Engineering Degree (BSEE/MSEE/PHD or equivalent experience)
  • 12+ years experience with Photonics products, with at least 5 years experience in packaging techniques like Flip Chip, Die Bond/Wire Bond, Hermetic, non-Hermetic.
  • Or an equivalent combination of education, training or experience.
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